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Evoc® Liquid cooling server

Evoc® Liquid cooling server

R522N6-LCP

Excellent performance, reliable and stable, flexible expansion, efficient and energy-saving liquid cooling server




EVOC Adam Server R522N6-LCP is a 2U dual path computational liquid cooled server designed by Yiwangke. Adopting a dual CPU liquid cooling design, comprehensive system heat dissipation optimization is carried out, easily taking away system heat and achieving better energy-saving effects. Based on the liquid cooling cluster scheme launched by Yiwangke, CDU and R522N6-LCP can be quickly connected, and a complete liquid cooling server system can be quickly built to meet the needs of Internet, IDC (Internet Data Center) cloud computing, artificial intelligence, high-performance computing and other application scenarios.

Product specification

Model

R522N6-LCP

Model

2U 19 inch rack mounted, with optional rails, W*H*D= 433mm x 87.6mm x 748mm

Processor

Supports 2 Intel third-generation Xeon ICE Lake expandable full range processors, Socket-P+4189 pin package, TDP 270W

Chipset

Intel C621A Server Specific Chipset

Memory

32 DIMMs, supporting 2666/2933/3200 MTS DDR4 ECC RDIMM/LRDIMM server memory, supporting up to 16 Aoteng 200 series persistent memory

Storage support

front 24 hot swappable 2.5 "SAS/SATA3.0 disk slots, built-in 2 M.2 interfaces

PCI-E Expansion

Supports up to 10 PCIe 4.0 extensions

Supports up to 2 full height, full length, dual width PCIe 4.0 x16 TDP 300W GPUs

Network support

onboard 2 gigabit electrical ports, onboard 1 OCP3.0 interface

BMC Function

Supports a unified management interface for IPMI, SNMP, and Redfish protocols

Interface&Indicator Light

Rear

2 USB 3.0 ports, 1 VGA port, 2 1GbE Ethernet ports

1 BMC management network port, 1 COM port, 1 UID button/indicator light

Front end

1 power switch button/indicator light, 1 health status light, 1 network indicator light

2 USB 3.0 ports, optional 1 VGA port

Liquid cooling pipeline

supports optional materials such as metal hard pipes, PTFE, FEP, EPDM, etc

System cooling

liquid cooling kit

System fan

Hot swappable redundant fan

Proportion of heat dissipation

85% liquid cooling, 15% air cooling

Rated flow rate

0.7-3L/min

Flow resistance

50-60kPa

Maximum water supply temperature

45 ℃

Power supply

Supports 800W/1300W/1600W/2200W hot swappable 1+1 redundant platinum power supply

OS

Microsoft Windows Server

CentOS

Red Hat Enterprise Linux

SUSE Linux Enterprise Server

0.076245s