亚当@液冷服务器

Evoc® Liquid cooling server

Evoc® Liquid cooling server

R822N6-LCP

The new generation of reliable, stable, high-density, and high-performance 2U liquid cooled servers




EVOC Adam Server R822N6-LCP is a 2U dual path computing liquid cooled server designed by Yiwangke for data centers and high-performance computing. This product adopts a cold plate indirect liquid cooling design, with warm water circulation, and a liquid cooling heat dissipation efficiency of over 80%. The good heat dissipation effect brings more outstanding performance. Based on the liquid cooling cluster solution launched by billions of grams, CDU can be quickly integrated with R822N6-LCP to quickly build a complete liquid cooling server system, designed specifically to meet ultra-high performance and low energy consumption application scenarios such as smart cities, intelligent healthcare, and smart finance.

Product specification

Model

R822N6-LCP

Model

2U 19 inch rack mounted, with optional rails, W*H*D= 433mm x 87.6mm x 748mm

Processor

Supports 2 Intel third-generation Xeon ICE Lake expandable full range processors, Socket-P+4189 pin package, TDP 270W

Chipset

Intel C621A Server Specific Chipset

Memory

32 DIMMs, supporting 2666/2933/3200 MTS DDR4 ECC RDIMM/LRDIMM server memory, supporting up to 16 Aoteng 200 series persistent memory

Storage support

8 hot swappable NVME drive slots, built-in 2 M.2 interfaces

PCI-E Expansion

Supports up to 10 PCIe 4.0 expansion slots

Maximum support for 2 full height, full length, dual width PCIe4.0 x16 TDP 300W GPUs

Network support

onboard 2 gigabit electrical ports, onboard 1 OCP3.0 interface

BMC Function

Supports a unified management interface for IPMI, SNMP, and Redfish protocols

Interface&Indicator Light

Rear

2 USB 3.0 ports, 1 VGA port, 2 1GbE Ethernet ports

1 BMC management network port, 1 COM port, 1 UID button/indicator light

Front end

1 power switch button/indicator light, 1 health status light, 1 network indicator light

2 USB 3.0 ports, optional 1 VGA port

Liquid cooling pipeline

supports optional materials such as metal hard pipes, PTFE, FEP, EPDM, etc

System cooling

liquid cooling kit

System fan

Hot swappable redundant fan

Proportion of heat dissipation

85% liquid cooling, 15% air cooling

Rated flow rate

2-3L/min

Flow resistance

50-60kPa

Maximum water supply temperature

45 ℃

Power supply

Supports 800W/1300W/1600W/2200W hot swappable 1+1 redundant platinum power supply

OS

Microsoft Windows Server

CentOS

Red Hat Enterprise Linux

SUSE Linux Enterprise Server