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Evoc® Liquid cooling server

Evoc® Liquid cooling server

H552N6-LCP

Superior performance, stable and energy-saving 4U high-density cold plate liquid cooling server




EVOC Adam Server H552N6-LCP is a 4U two-way storage server designed for IDC (Internet Data Center) and high-performance computing scenarios. It adopts a dual CPU cold plate liquid cooling cooling scheme. The system is optimized for all-round heat dissipation, which can easily take away a lot of heat from the system, reaching the ideal PUE value. Based on the liquid cooling cluster solution launched by billions of grams, H552N6-LCP can be quickly integrated with CDU to quickly build a complete liquid cooling server system. H552N6-LCP has the characteristics of high-capacity storage, high-performance computing and flexible IO expansion. It is a storage server with superior performance and can be widely used in Internet, cloud computing, artificial intelligence, big data and other application scenarios.

Product specification

Model

H552N6-LCP

Model

4U 19 inch rack mounted, with optional rails, W*H*D= 438.4mm x 176mm x 830mm

Processor

Supports 2 Intel third-generation Xeon Scalable processors, LGA4189,TDP 270W

Chipset

Intel C621A Server Specific Chipset

Memory

32 DIMMs, supporting 2666/2933/3200 MTS DDR4 ECC RDIMM/LRDIMM server memory, can support 16 Aoteng 200 series persistent memory

Storage support

Front 24 3.5 "/2.5" hot swappable SAS/SATA3.0 hard drives

Up to 4 2.5 "hot swappable hard drives can be optionally installed at the rear

PCI-E Expansion

Up to 10 PCIe expansion slots available for customers to flexibly expand

BMC Function

Supports a unified management interface for IPMI, SNMP, and Redfish protocols

Interface&Indicator Light

Rear 2 USB 3.0, 1 VGA interface, 2 1GbE Ethernet ports

1 BMC management network port, 1 COM port, 1 UID button/indicator light

Front mounted 1 power switch button/indicator light, 1 health status light, 1 network indicator light

2 USB 3.0 ports, optional 1 VGA port

Liquid cooling pipeline

supports optional materials such as metal hard pipes, PTFE, FEP, EPDM, etc

System cooling

liquid cooling kit, cold plate liquid cooling kit, parallel connection of cold plate components, warm water circulation

System fan hot plug redundant fan

Proportion of heat dissipation

85% liquid cooling, 15% air cooling

Rated flow rate

0.7-3L/min

Flow resistance

50-60kPa

Maximum water supply temperature

45 ℃

Power supply

800W/1300W/1600W hot swappable redundant platinum power supply

OS

Microsoft Windows Server

CentOS

Red Hat Enterprise Linux

SUSE Linux Enterprise Server

0.060780s