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Evoc® Liquid cooling server

Evoc® Liquid cooling server

R322N6-LCP

19 inch rack type
Leading performance, efficient and energy-saving 2U cold plate server




R322N6 LCP is a 2U dual path computing liquid cooled server designed by YiwangKe specifically for data centers. Adopting a dual CPU liquid cooling design, comprehensive system heat dissipation optimization is carried out, providing both air-cooled and cold plate dual heat dissipation modes. The liquid cooling heat dissipation efficiency is over 80%, and the energy-saving effect is more outstanding. Based on the liquid cooling cluster solution launched by billions of grams, CDU can be quickly integrated with R322N6-LCP to form a complete liquid cooling server system, meeting the needs of high performance and low energy consumption application scenarios such as cloud computing and big data.

Product specification

Model

R322N6-LCP

Model

2U 19 inch rack mounted, with optional rails, W*H*D= 433mm x 87.6mm x 748mm

Processor

Supports 2 Intel third-generation Xeon ICE Lake expandable full range processors, Socket-P+4189 pin package, TDP 270W

Chipset

Intel C621A Server Specific Chipset

Memory

32 DIMMs, supporting 2666/2933/3200 MTS DDR4 ECC RDIMM/LRDIMM server memory, supporting up to 16 Aoteng 200 series persistent memory

Storage support

8 hot swappable 3.5 "SAS/SATA 3.0 disk slots, built-in 2 M.2 interfaces

PCI-E Expansion

Supports up to 10 PCIe 4.0 extensions

Maximum support for 2 full height, full length, dual width PCIe4.0 x16 TDP 300W GPUs

Network support

onboard 2 gigabit electrical ports, onboard 1 OCP3.0 interface

TPM

1 TPM 2.0 interface

BMC Function

Supports a unified management interface for IPMI, SNMP, and Redfish protocols

Interface&Indicator Light

Rear 2 USB 3.0, 1 VGA interface, 2 1GbE Ethernet ports

1 BMC management network port, 1 COM port, 1 UID button/indicator light

Front mounted 1 power switch button/indicator light, 1 health status light, 1 network indicator light

2 USB 3.0 ports, optional 1 VGA port

Liquid cooling pipeline

supports optional materials such as metal hard pipes, PTFE, FEP, EPDM, etc

System cooling

liquid cooling kit, cold plate liquid cooling kit, parallel connection of cold plate components, warm water circulation

System fan hot swappable redundant fan

Proportion of heat dissipation

85% liquid cooling, 15% air cooling

Rated flow rate

0.7-3L/min

Flow resistance

50-60kPa

Maximum water supply temperature

45 ℃

Power supply

Supports 550W \ 800W \ 1300W \ 1600W \ 2200W hot swappable 1+1 redundant platinum power supply

OS

Microsoft Windows Server

CentOS

Red Hat Enterprise Linux

SUSE Linux Enterprise Server